• May 15, 2019 News!Vol.7, No.5- Vol.8, No.4 has been indexed by EI (Inspec).   [Click]
  • Aug 01, 2018 News! [CFP] 2020 the annual meeting of IJMO Editorial Board, ECDMO 2020, will be held in Athens, Greece, February 15-17, 2020.   [Click]
  • Sep 30, 2019 News!Vol 9, No 6 has been published with online version. 12 original aritcles from 6 countries are published in this issue.    [Click]
General Information
    • ISSN: 2010-3697  (Online)
    • Abbreviated Title: Int. J. Model. Optim.
    • Frequency: Bimonthly
    • DOI: 10.7763/IJMO
    • Editor-in-Chief: Prof. Adrian Olaru
    • Executive Editor: Ms.Yoyo Y. Zhou
    • Abstracting/ Indexing: ProQuest, Crossref, Electronic Journals Library, Google Scholar, EI (INSPEC, IET), EBSCO, etc.
    • E-mail ijmo@iacsitp.com
Prof. Adrian Olaru
University Politehnica of Bucharest, Romania
I'm happy to take on the position of editor in chief of IJMO. It's a journal that shows promise of becoming a recognized journal in the area of modelling and optimization. I'll work together with the editors to help it progress.
IJMO 2015 Vol.5(5): 345-348 ISSN: 2010-3697
DOI: 10.7763/IJMO.2015.V5.486

Improvement of Wafer Saw Film Burr Issues

Te-Jen Su, Chien-Liang Chiu, Yi-Feng Chen, Shih-Mine Wang, Tung-Yen Tsou
Abstract—FOW (Film On Wire) is one method of stack die for IC assembly process. This film material would cover the gold wire which electrical conduction, to prevent the gold wire damage cause the product fail in the stack die chip on die bond process, but this film is easy to occur film burr issue during wafer dicing saw process. If film burr occur, it will cause die bond pad contamination, such that will cause gold wire can’t eutectic with bond pad, and IC product will be fail then cause yield loss. In this paper, experiment how to apply the blade dressing method improvement film burr issue, is also investigated developed new dressing board material to increase quality and reduce cost, thus achieving a win-win outcome.

Index Terms—FOW (Film On Wire), film burr, blade dressing

The authors are with National Kaohsiung University of Applied Sciences, Taiwan (e-mail: 2102305123@gm.kuas.edu.tw, sutj@cc.kuas.edu.tw, eagle@cc.kuas.edu.tw, wwang16@gmail.com).


Cite: Te-Jen Su, Chien-Liang Chiu, Yi-Feng Chen, Shih-Mine Wang, Tung-Yen Tsou, "Improvement of Wafer Saw Film Burr Issues," International Journal of Modeling and Optimization vol. 5, no. 5, pp. 345-348, 2015.

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