Abstract—FOW (Film On Wire) is one method of stack die for IC assembly process. This film material would cover the gold wire which electrical conduction, to prevent the gold wire damage cause the product fail in the stack die chip on die bond process, but this film is easy to occur film burr issue during wafer dicing saw process. If film burr occur, it will cause die bond pad contamination, such that will cause gold wire can’t eutectic with bond pad, and IC product will be fail then cause yield loss. In this paper, experiment how to apply the blade dressing method improvement film burr issue, is also investigated developed new dressing board material to increase quality and reduce cost, thus achieving a win-win outcome.
Index Terms—FOW (Film On Wire), film burr, blade dressing
The authors are with National Kaohsiung University of Applied Sciences, Taiwan (e-mail: 2102305123@gm.kuas.edu.tw, sutj@cc.kuas.edu.tw, eagle@cc.kuas.edu.tw, wwang16@gmail.com).
[PDF]
Cite: Te-Jen Su, Chien-Liang Chiu, Yi-Feng Chen, Shih-Mine Wang, Tung-Yen Tsou, "Improvement of Wafer Saw Film Burr Issues," International Journal of Modeling and Optimization vol. 5, no. 5, pp. 345-348, 2015.
