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General Information
    • ISSN: 2010-3697
    • Frequency: Bimonthly
    • DOI: 10.7763/IJMO
    • Editor-in-Chief: Prof. Adrian Olaru
    • Executive Editor: Ms.Yoyo Y. Zhou
    • Abstracting/ Indexing: Engineering & Technology Digital Library, ProQuest, Crossref, Electronic Journals Library, Google Scholar, EI (INSPEC, IET).
    • E-mail ijmo@iacsitp.com
Editor-in-chief
Prof. Adrian Olaru
University Politehnica of Bucharest, Romania
I'm happy to take on the position of editor in chief of IJMO. It's a journal that shows promise of becoming a recognized journal in the area of modelling and optimization. I'll work together with the editors to help it progress.
IJMO 2013 Vol.3(5): 386-389 ISSN: 2010-3697
DOI: 10.7763/IJMO.2013.V3.304

Application of Vapor Phase Soldering (VPS) for Joints Reliability Improvement

Agata Skwarek, Beata Synkiewicz, Krzysztof Witek, and Sebastian Wronski
Abstract—The reliability of an electronic system may depend on solder joint work. Various methods are used at present to improve joint reliability One possibility is vapor phase soldering (VPS). The biggest advantages of VPS are high efficiency and uniform heating characteristics. It is also possible to ensure good control of the soldering temperature, an oxygen free soldering atmosphere, and, especially a higher rate of heat transfer. Joints made with VPS can be more uniform with fewer defects than in joints made with reflow soldering. However, the choice of solder alloy used for VPS may be a key factor in the quality of the junction.

Index Terms—Solder joints, vapor phase soldering, ceramic elements.

Agata Skwarek, Beata Synkiewicz, Krzysztof Witek are with Institute of Electron Technology, Zablocie 39, 30-424 Krakow, Poland (e-mail: askwarek@ite.waw.pl)
Sebastian Wronski is AGH- University of Science and Technology, Al. Mickiewicza 30, 30-059 Krakow, Poland (e-mail: sebastian.wronski@gmail.com)

[PDF]

Cite:Agata Skwarek, Beata Synkiewicz, Krzysztof Witek, and Sebastian Wronski, "Application of Vapor Phase Soldering (VPS) for Joints Reliability Improvement," International Journal of Modeling and Optimization vol. 3, no. 5, pp. 386-389, 2013.

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